DESIGNER MOLECULES, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C07C ACYCLIC OR CARBOCYCLIC COMPOUNDS 10128
 
 
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 10115
 
 
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 10110
 
 
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 9107
 
 
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 847
 
 
 
C07D HETEROCYCLIC COMPOUNDS 4158
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
 
 
C07F ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM 268
 
 
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 272
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9278909 Amide-extended crosslinking compounds and methods for use thereofAug 19, 13Mar 08, 16[C09J, C07D, C07C]
8816021 Curable composition with rubber-like propertiesSep 09, 11Aug 26, 14[C09J, C08G, C08L, C08K]
8710682 Materials and methods for stress reduction in semiconductor wafer passivation layersMar 15, 13Apr 29, 14[H01L]
8686162 Maleimide-functional monomers in amorphous formAug 25, 11Apr 01, 14[C07D]
8637611 Amide-extended crosslinking compounds and methods for use thereofAug 13, 09Jan 28, 14[C07D]
8541531 Anti-bleed compounds, compositions and methods for use thereofMar 23, 09Sep 24, 13[C08G]
8530573 Modified calcium carbonate-filled adhesive compositions and methods for use thereofMay 09, 07Sep 10, 13[C09J]
8513375 Imide-linked maleimide and polymaleimide compoundsFeb 04, 11Aug 20, 13[C08G]
8431655 Curatives for epoxy compositionsJun 15, 10Apr 30, 13[C07C, C08L]
8415812 Materials and methods for stress reduction in semiconductor wafer passivation layersSep 02, 10Apr 09, 13[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0344,627 LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESISTAbandonedNov 20, 13Dec 03, 15[H01L, C08G, G03F]
2014/0272,435 ANTI-STICK SURFACE COATINGSAbandonedMar 15, 13Sep 18, 14[C09D]
2014/0275,413 HEAT AND MOISTURE RESISTANT ANAEROBIC ADHESIVES AND SEALANTSAbandonedMar 18, 14Sep 18, 14[C09J]
2014/0020,827 ANTI-BLEED COMPOUNDS, COMPOSITIONS AND METHODS FOR USE THEREOFAbandonedSep 23, 13Jan 23, 14[H01L]
2013/0313,489 SOLUBLE METAL SALTS FOR USE AS CONDUCTIVITY PROMOTERSAbandonedMar 13, 13Nov 28, 13[C09J]
2013/0299,747 CURATIVES FOR EPOXY COMPOSITIONSERSAbandonedMar 11, 13Nov 14, 13[C08G]
2013/0203,895 CURING AGENTS FOR EPOXY RESINSAbandonedMar 15, 13Aug 08, 13[C08G]
2013/0199,724 CURATIVES FOR EPOXY COMPOSITIONSAbandonedMar 15, 13Aug 08, 13[C08G]
2013/0187,095 THERMOSETTING ADHESIVE COMPOSITIONSAbandonedFeb 16, 13Jul 25, 13[C09J]
2013/0012,620 CURING AGENTS FOR EPOXY RESINSAbandonedMar 16, 11Jan 10, 13[C09J, C08G, C07D, C09D]
2010/0113,643 CURATIVES FOR EPOXY ADHESIVE COMPOSITIONSAbandonedApr 09, 08May 06, 10[C09J, A61K, C07F, C08G, C07D, C07C, C08L]
2010/0056,671 POLYFUNCTIONAL EPOXY OLIGOMERSAbandonedApr 14, 08Mar 04, 10[C09J, C08G, C08F]
2008/0262,191 METHODS FOR THE PREPARATION OF IMIDES, MALEIMIDES AND MALEIMIDE-TERMINATED POLYIMIDE COMPOUNDSAbandonedJan 28, 08Oct 23, 08[C08G, C07D]
2006/0009,578 Compositions containing maleimide-substituted silsesquioxanes and methods for use thereofAbandonedJul 07, 05Jan 12, 06[C08G, C08L, B32B]
2005/0267,254 Functionalized urethanes and methods for use thereofAbandonedMay 02, 05Dec 01, 05[C08K]

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